| process |
ltem |
2009 |
| General |
Layers |
1-14 Layers |
| Board Thickness |
0.4-2.4mm |
| Max working panel board size |
18.5" x 24.5" |
| Impedance Control(Single-ended) |
+/-10% |
| Impedance Control(Differential) |
+/-10% |
| Blind/Buried vias |
Sequential |
| Warpage and Twist |
0.75% |
| Min core thickness |
0.076mm |
| Press Fit hole tolerance |
+/-0.05mm |
| Surface Finish |
|
|
| 1.Gold Finger plating |
Au/Ni thickness |
Au: 10-40u"/Ni: 120u" |
| 2.HAL Lead Free |
Thickness |
30-1000u" |
| 3.OSP/Pre-Flux |
Thickness |
8-20u" |
| 4.ENIG |
Au/Ni thickness |
Au:1-3u"/Ni:120u" |
| 5.Immersion White Tin |
Tin thickness |
30-50u" |
| 6. Immersion Silver |
Silver thickness |
6-15u" |
|
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