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process ltem 2009 2010 2011 Unit Notes
General Layers  1-14 Layers 1-14 Layers up to 18 layers 　 　
　 Board Thickness 0.4-2.4mm 0.4-3.2mm 0.4-3.2mm mm 　
　 Max working panel board size 18.5" x 24.5" 20" x 24.5" 20" x 24.5" inch 　
　 Impedance Control(Single-ended) +/-10% +/-8% +/-8% % 　
　 Impedance Control(Differential) +/-10% +/-8% +/-8% % 　
　 Blind/Buried vias Sequential Sequential HDI/Laser 　 　
　 Warpage and Twist 0.75% 0.50% 0.50% % 　
　 Min core thickness 0.076mm 0.05mm 0.05mm mm 　
　 Press Fit hole tolerance +/-0.05mm +0.02/-0.06mm +0.02/-0.06mm mm 　
　 　 　 　 　 　 　
Material FR4 Tg 130(RoHS compliance) Available 　 　 　 　
　 FR4 Tg 170(RoHS compliance) Available 　 　 　 　
　 FR4 Lead-free compatible Available 　 　 　 　
　 Halogen Free ( Tg 150 & Tg 170 ) Available 　 　 　 　
　 Aluminium Base Available 　 　 　 　
　 High Speed Material  Available 　 　 　 　
　 　 　 　 　 　 　
Inner layer Minimum Space Line to line  4/4 mil 3/3 mil 3/3 mil mil 1 OZ base copper
　 Registration Tolerance  +/- 3mil +/-2 mil +/-2mil mil 　
　 Etching undercut(total) 0.5mil 0.5 mil 0.5 mil mil 1/2 OZ base copper
　 Etching undercut(total) 1.0 mil 1.0 mil 1.0 mil mil 1 OZ base copper
　 Circuit width tolerance +/-15% +/-15% +/-15% % 　
　 Copper weight 4 OZ 　 　 　 　
　 　 　 　 　 　 　
Lamination Layer-Layer Registration +/-
Tolerance		 4 mils 4 mils 4 mils mil 　
　 Copper weight (external) 4 OZ   4 OZ 4 OZ 　 　
　 Board thickness tolerance +/-10% +/-8% +/-8% % 　
　 　 　 　 　 　 　
Drilling Drill Size 0.15-6.5mm 0.20-6.55mm 0.20-6.55mm mm 　
　 True position +/- 2 mils +/- 2mils +/- 2mils mil 　
　 Roughness 1.4 mils 1.2 mils 1.2 mils mil 　
　 　 　 　 　 　 　
PTH Aspect Ratio 7 to 1 8 to 1 8 to 1 　 　
　 Minimum PTH Hole Diameter+/- 3 mils 2 mils 2 mils mil 　
　 Max. Board Thickness 110 mils 126 mils 126 mils mil 　
　 Min. Board Thickness 15.7 mils 15.7 mils 15.7 mils mil 　
　 　 　 　 　 　 　
Dry Film (External) Mini Space Line to line  3.75 mils 3.5 mils 3.5 mils mil 　
　 Mini Space Line to pad/ pad to pad 4 mils 4 mils 3.75 mils mil 　
　 　 　 　 　 　 　
Pattern plating Aspect Ratio  7 to 1 8 to 1 8 to 1 　 　
　 　 　 　 　 　 　
　 　 　 　 　 　 　
Solder Mask  Soldermask Reqistration Tolerance +/-2 mils +/-2 mils +/-2 mils mil 　
　 Minimum Soldermask Web 4 mils 4 mils 3 mils mil 　
　 Soldermask bridge 4 mils 4 mils 3 mils mil 　
　 Soldermask Thickness >0.4 mil >0.4 mil >0.4 mil mil 　
　 　 　 　 　 　 　
Surface Finish  　 　 　 　 　 　
1.Gold Finger plating Au/Ni thickness Au: 10-40u"/Ni: 120u" Au: 10-40u"/Ni: 120u" Au: 10-40u"/Ni: 120u" u" 　
　 　 　 　 　 　 　
2.HAL Lead Free Thickness 30-1000u" 30-1000u" 30-1000u" u" 　
　 　 　 　 　 　 　
3.OSP/Pre-Flux Thickness 8-20u" 8-20u" 8-20u" u" 　
　 　 　 　 　 　 　
4.ENIG Au/Ni thickness Au:1-3u"/Ni:120u" Au:1-3u"/Ni:120u" Au:1-3u"/Ni:120u" u" 　
　 　 　 　 　 　 　
5.Immersion White Tin Tin thickness 30-50u" 30-50u" 30-50u" u" 　
　 　 　 　 　 　 　
6. Immersion Silver Silver thickness 6-15u" 6-15u" 6-15u" u" 　
　 　 　 　 　 　 　
Legend printing Minimum Space Line 5 mils 5 mils 4 mils mil 　
　 Registration Tolerance +/-5 mils +/-4 mils +/-4 mils mil 　
　 　 　 　 　 　 　
Routing 　 　 　 　 　 　
1.Router Size Tolerance +/-5 mils +/-5 mils +/-4 mils mil 　
　 　 　 　 　 　 　
2.V-Cut Remain Thickness Tolerance +/- 4mils +/- 4mils +/- 4 mils mil 　
　 Cutter angle & tolerance 30+/-5; 45+/-5 degrees 30+/-5; 45+/-5 degrees 30+/-5; 45+/-5 degrees degree 　
　 Jump- scoring Available Available Available 　 　
　 　 　 　 　 　 　
　 　 　 　 　 　 　
Electrical Testing  Minimu component pitch tseting 5 mils 5 mils 4 mils mil 　
　 Minimum SMT Feature Pitch  10 mils 8 mils 8 mils mil