HDI

1. Layer count: 16 Layer
2. Board thickness: 0.6mm-2.4mm
3. HDI Type: 1+ N+ 1, 1+1+N+1+1
4. Laser Via formed method: Direct Copper Drill, CO2
5. Copper thickness(Layer with laser drill): 1/3 OZ started and plated to 1 mils min.
6. Base copper thickness(Layer without laser drill): 1/3 OZ, 1/2 OZ, 1 OZ, 2 OZ, 3 OZ
7. Buried Via design: Yes
8. VIP design: Yes
9. Aspect Ratio(Through holes):10:1
10. Laser Via filling: No