|
| www.gainbase.com |
Home > About Us > Capabilities |
| Capabilities |
|
| Manufacturing Capabilities Overview
as of 30 September 2003 |
| Description |
Details |
| Materials |
Paper Phenonic, CEM-1, CEM-3, FR-1, FR-2, FR-4 |
| Number of Layers |
Single Sided, Double Sided, Multi-layer
1 to 14 Layers (Mass production) |
| Line Width/Spacing |
Minimum 5mil/ 5mil or 0.127mm/ 0.127mm
Fineline 4mil/ 4mil or 0.1mm/ 0.1mm |
| Minimum Hole Diameter |
Drilling : 12mil (0.3mm)
Punching : 28mil (0.7mm) |
| Carbon Ink Resistence |
<100 Ohm |
| SMT Pitch |
<20 MIL (0.5mm) |
| Solder Mask Types |
Photo Imageable
Conventional ¨C Thermal Cure U.V. Cure |
| Board Finish |
Immersion Tin
Immersion Gold
Electrolytic Gold Plating
HAL, Hot Air Leveling
Entek, OSP
Carbon Thru Hole
Peelable Soldermask
Coutersunk Holes |
| CNC V-Cut |
X-Y axis 30, 45, 60 degree
Jumping V-Cut, 60 degree |
| Outline Profile |
V - Cut if required
Punched Outline
CNC Routing |
|
| |
|
