| Process |
Control Parameters |
Dept / Locations |
| IQC |
Careful handling
Use interleaved paper separator
|
IQC |
| Board Cut |
Punch radius angle
No sharp edges |
Board cut room |
| Punching Guide Hole & Silkscreen Hole |
1. First, design panel drawing according to unit
size
2. Push material into punch die, punch guide hole,
do not cause any scratch in punching process |
Autoline punching room |
| Deburring |
1. Testing grind wheel before production
2. Only opening grind wheel from bottom side to
prevent hurting the film on the top grind wheel
|
Autoline |
| Silkscreen Circuits |
1. First article sample had to be approved by
customer before production
2. Will print the silkscreen matt |
Autoline |
| Drying |
Check the energy for the UV machine first and
adjust the speed for the UV machine to suit the
board requirement |
Autoline |
| Etching |
1. Cold process had to be taken after the UV process,
and lamination occurred in production
2. First article sample had to be checked before
production |
Autoline |
| Deburring |
1. Scratches avoiding test launched before production
2. Only upper roller had been operated while lower
roller had been stopped to prevent hurting the film |
Soldermask room |
| Punch |
1. Each time before punching the PCB, cleaning
the punch die, and punching on empty boards.
2. After half an hour production, self-audit once
3. Provide panel drawing for material precision
of punching |
Punching Room |
| V-Cut |
1. First article before production
2. Self-audit once per half an hour
3. Handling carefully in production, separate each
PCB from tools & pay attention to scratch
4. Ask for new material for V-Cut knife |
V-Cut Room & Purchasing |
| Reliability Test |
Feedback to PE and QA on time when Problems found |
S/A, QA |
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