Materials
CEM-3, FR-4, Halogen Free, High Tg, High Frequency, Aluminium Clad and Copper Clad
Layer Coverage
Single side to 24 Layers,
Build up 3+N+3 HDI
Build up 3+N+3 HDI
Board Thickness
0.4mm to 5.0mm for double sided,
0.4mm up for multi-layers
0.4mm up for multi-layers
Copper Cladding
Inner: 18µm ~ 210µm
Outer: 12µm ~ 210µm
Outer: 12µm ~ 210µm
Minimum Trace
(Width/Spacing) 0.05mm
Hole Size Tolerance
(PTH) ±0.05mm, (NPTH) ±0.05mm
Minimum Hole Size
0.15mm finished mechanical,
0.1mm finished laser drill
0.1mm finished laser drill
Surface Treatment
Flash Gold, HAL LF, Immersion Gold, Immersion Silver, Immersion Tin, Pre-Flux (OSP)
